機器尺寸(L x W x H) | 483 mm x 295mm x 284 mm |
機器重量 | 13.2kg |
紙張寬度 | 114/19 mm (4.5/0.75 in) |
紙張厚度 | 3 mil to 10.4 mil |
紙張外徑 | 213 mm (8.38 in) |
紙芯尺寸 | 38-76 mm (1.5-3 in) |
碳帶外徑 | 80 mm (3.15 in), capacity of 450 m |
碳帶芯尺寸 | 25mm (1 in) |
碳帶寬度 | 110mm |
碳帶長度 | 450m |
打印模式 | Direct Thermal / Thermal Transfer |
分辨率 | 203dpi / 300dpi / 406dpi / 600dpi |
打印速度 | 203 dpi: 350 mm/s 300 dpi: 300 mm/s 406 dpi: 250 mm/s 600 dpi: 150 mm/s |
打印寬度 | 203 dpi: 108 mm 300 dpi: 105.7 mm 406 dpi: 104 mm 600 dpi: 105.6 mm |
打印長度 | 203 dpi: 4.8 m 300 dpi: 2.2m 406 dpi: 1.2 m 600 dpi: 0.55m |
操作溫度 | +5°C to +40°C |
儲存溫度 | -20°C to +70°C |
操作濕度 | 20 to 85% non-condensing |
儲存濕度 | 5 to 90% non-condensing |
內存 | 512 MB Flash memory, 256 MB SDRAM, Multi-GB USB memory device (FAT16/FAT22) User Partitioning: 256MB |
紙張傳感器 | Gap, Notch, Black mark, Continous, Media low, Media end |
通訊接口 | Ethernet 10/100 Mbps USB 2.0 Host (x2 PM45) USB 2.0 Device RS-232, up to 115.2 KB/s IEEE 802.11 a/b/g/n/ac; Wi-Fi certified, 1x1 SISO V5.0 Bluetooth and BLE Supported |
顯示 | Full Touch UI, Icon UI |
程序語言 | Fingerprint (FP) DPL XML-enabled for SAP AII and Oracle WMS Intermec Printer Language (IPL) C# Smart Printing ZSim2 (ZPL-II) Direct Protocol (DP) |
條形碼種類 | All major 1D and 2D symbologies are supported |
電源 | AC Voltage: 100 to 240V AC, 50 to 60 Hz Power Consumption: Standby 9.6W; Peak 270W (24V), Peak 145W (33V) |
安規認證 | RoHS Compliant, CE (EN55032 Class B*), FCC Class B*, Energy Star 3.0 Qualified |
RFID選購配件 | RFID – Supports EPC Class 1 Gen2, 18000-6C. Radio configured to comply with local UHF RFID regulations including FCC and ETSI |